Noohapou Fundamentals Explained
Noohapou Fundamentals Explained
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The POU3500 program features dynamic temperature Charge of the procedure chamber cathode / electrode / anode and will be synchronized with any etch system.
thirty% of its peak power intake, featuring our clients considerable reduction in operating prices and elevated reliability.
the data down below is categorized by semiconductor course of action and Software maker. Each desk contains an Applications Matrix that shows qulified and professional procedures.
Originally Established in 1985, our company has developed right into a recognized leader in delivering temperature Manage methods to the global semiconductor business.
This impressive system, presenting a little kind factor, inexpensive-of-Ownership and Dynamic Temperature Manage provided system and devices engineers a completely new Instrument to enhance their temperature delicate processes.
The precision from the POU 3300 allows for unbiased control of the method fluid temperature for the wafer chuck in +/- 0.1 °C of established level, along with the rapidly response time from the system lets for max wafer-to-wafer repeatability all through the etch course of action.
All static TCUs involve surplus cooling & heating capacities because of their very substantial method fluid reservoirs. the procedure fuid reservoir on LAUDA-Noah's dynamic temperature Command method is less than 1 gallon.
With our device strategically mounted close to 6 ft from your chamber, we attain a way more exact reading of your chuck temperature. This strategy ensures regular temperature all through the production lot, leading to enhanced wafer-to-wafer CD uniformity.
The data pertains to the 300mm chamber temperature profile throughout a large part ratio Etch approach, working at really substantial RF electricity problems (~3.8kW). The compelling components of this info established are:
Dynamic Temperature Regulate, as implemented in programs like the LAUDA-Noah POU, is really an strategy that senses the temperature of the procedure fluid coming back from the procedure chamber’s wafer chuck (ESC) and dynamically adjusts the temperature of your equipped method fluid based on this authentic-time opinions.
The data established here is from a 200mm quantity output wafer fab and Evidently illustrates the advantage of the LAUDA-Noah POU procedure.
The POU3300 procedure offers dynamic temperature Charge of the method chamber cathode / electrode / anode and might be synchronized with any etch click here course of action.
the fact is that legitimate Dynamic Temperature Management can only be achieved when all 5 (five) of the following program design and installation necessities are achieved:
(consequently, putting in a static unit close to chamber will never permit it to provide dynamic temperature Management)
We involve much less cooling/heating ability for the same software as being a static TCU because of our smaller reservoir quantity.
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